Introduction
Chapter 6, POSIX API. The best-known API for accessing and managing files and
directories is specified within the POSIX standard (IEEE Std 1003.1), which is based in part
in the ISO C standard (ISO/IEC 9899). This chapter explains how to use this API and
examines some of its pitfalls and shortcomings.
Chapter 7, Files. μC/FS complements the POSIX API with its own file access API. This
chapter explains this API.
Chapter 8, Directories. μC/FS complements the POSIX API with its own directory access
API. This chapter explains this API.
Chapter 9, FAT File System. This chapter details the low-level architecture of the FAT file
system. Though the API of μC/FS is file system agnostic, the file system type does affect
performance, reliability and security, as explained here as well.
Chapter 10, Device Drivers. All hardware accesses are eventually performed by a device
driver. This chapter describes the drivers available with μC/FS and broadly profiles
supported media types in terms of cost, performance and complexity.
Chapter 11, IDE Devices. The IDE driver supports compact flash (CF) cards and ATA IDE
hard drives.
Chapter 12, Logical Devices Driver. This feature is not available yet.
Chapter 13, Mass Storage Class (MSC) Driver. The now-common USB drive implements
the Mass Storage Class (MSC) protocol, and a CPU with a USB host interface can access
these devices with appropriate software. The MSC driver, discussed in this chapter, with
μC/USB-Host is just such appropriate software.
Chapter 14, NAND Flash. NAND flash is the first category of flash media. Write speeds
are fast (compared to NOR flash), at the expense of slower read speeds and complexities
such as bit-errors and page program limitations. This chapter describes the functions of
these devices and the architecture of the supporting driver.
Chapter 15, NOR Flash. NOR flash is the second category of flash media. They suffer
slow write speeds, balanced with blazingly-fast read speeds. Importantly, they are not
plagued by the complications of NAND flash, which simplifies interfacing with them. This
chapter describes the function of these devices and the architecture of the supporting driver.
20
相关PDF资料
AD-UCOS3-SPRD PRD LIC UCOS3 RTOS CORE CCES SGL
AD-UCUSBD-SPRD PRD LIC UCUSB DEV CORE CCES SGL
AD637-EVALZ BOARD EVALUATION FOR AD637
AD736-EVALZ BOARD EVALUATION FOR AD736
AD737-EVALZ BOARD EVALUATION FOR AD737
AD8007AKS-EBZ BOARD EVAL FOR AD8007AKS
AD8018ARU-EVAL BOARD EVAL FOR AD8018
AD8034ART-EBZ BOARD EVAL FOR AD8034ART
相关代理商/技术参数
ADuC-H7020 功能描述:开发板和工具包 - ARM HDR BRD FOR ADUC7020 ARM7 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V
ADuC-IO7020 功能描述:开发板和工具包 - ARM DEV BRD FOR ADUC7020 ARM7 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V
ADUCM3027BCBZ-R7 功能描述:LOWPWR CORTEXM3W/128KKEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1,500
ADUCM3027BCBZ-RL 功能描述:LOWPWR CORTEXM3W/128KKEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:5,000
ADUCM3027BCPZ 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:托盘 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C,SPI,UART/USART 外设:DMA,POR,PWM,WDT I/O 数:44 程序存储容量:128KB(128K x 8) 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源(Vcc/Vdd):1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C(TA) 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP(9x9) 标准包装:1
ADUCM3027BCPZ-R7 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:剪切带(CT) 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C,SPI,UART/USART 外设:DMA,POR,PWM,WDT I/O 数:44 程序存储容量:128KB(128K x 8) 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源(Vcc/Vdd):1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C(TA) 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP(9x9) 标准包装:1
ADUCM3027BCPZ-RL 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:带卷(TR) 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C,SPI,UART/USART 外设:DMA,POR,PWM,WDT I/O 数:44 程序存储容量:128KB(128K x 8) 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源(Vcc/Vdd):1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C(TA) 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP(9x9) 标准包装:2,500
ADUCM3029BCBZ-R7 功能描述:LOWPWR CORTEX M3W/256KEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1,500